CNC machining in Bakelite

What is bakelite Board

1. What is bakelite board:

Bakelite board is also called bakeboard and phenolic laminated board (phenolic board). It uses high-quality bleached wood paper and cotton velvet paper as reinforcements, and is made by reacting high-purity, fully synthetic petrochemical raw materials. Wood boards made of phenolic resin used as resin binder.

2. Bakelite board application:

It is suitable for motors, electrical equipment and insulating structural parts with high mechanical performance requirements. It has good mechanical strength and is mainly used in the processing of insulating parts in ICT and ITE fixtures, test fixtures, silicone rubber button molds, fixture plates, mold splints, table grinding pads, packaging machines, tea trays, combs, etc.

3. How to process bakelite boards:

CNC engraving machine can be used for engraving, CNC drilling machine for drilling, engraving, surface milling, and CNC machining center for processing and cutting.

4. Thickness of bakelite board:

The thickness of bakelite boards generally includes: 3, 5, 9, 12, 15, 18mm, etc. The usual length and width specifications are: 1220*2440. Electrical plywood is usually made into three layers, five layers, seven layers, etc.

To prevent edge chipping when processing bakelite, you can take the following precautions:

Choose the right tool: Use sharp, sharp tools, such as high-hardness carbide tools or tools with high rotational speeds. This can reduce cutting pressure and reduce edge chipping caused by concentrated stress on the edge.

Control the cutting speed and feed speed: When processing bakelite, the cutting speed and feed speed should be controlled to avoid excessive cutting caused by excessive cutting speed and feed speed. Appropriate reduction of cutting speed and feed speed can reduce cutting force, reduce edge stress, and reduce the risk of edge chipping.

Choose the appropriate cutting direction: When processing bakelite, you should choose the appropriate cutting direction and try to avoid cutting the tool vertically in the direction of the bakelite grain, because this will easily lead to fiber layer peeling and increase the possibility of edge chipping. You can choose to cut parallel to the grain direction or along the grain direction to reduce the risk of peeling.

Properly control the cutting depth: When processing bakelite, the cutting depth should be properly controlled and try to avoid too large a cutting depth at one time. The gradually decreasing cutting depth can reduce the concentration of cutting force and reduce the occurrence of edge chipping.

Conduct a trial cutting test in advance: Before formal processing, it is recommended to conduct a trial cutting test, adjust the tool, cutting parameters, etc., and make appropriate optimizations based on the test results to reduce the problem of edge chipping.

To sum up, by selecting the appropriate tool, controlling the cutting speed and feed speed, selecting the appropriate cutting direction, properly controlling the cutting depth, and conducting trial cutting experiments, the edge chipping phenomenon during bakelite processing can be effectively reduced.