Polyimide PI Vespel equivalent rod

Name: polyimide sheet Vespel SP-1 sheet
Uploaded: 2023-02-06T14:19:15+08:00
Description: polyimide sheet Vespel SP-1 sheet

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Payment Type:	T/T,Paypal
Incoterm:	FOB,CFR,CIF,EXW,DDU
Min. Order:	1 Kilogram
Transportation:	Ocean,Land,Air,Express
Port:	Shenzhen,Guangzhou,Hongkong

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Product Description

Product Attributes

Model No.: Vespel Sheet Rod

Brand: HONYPLAS

Packaging & Delivery

Selling Units

Kilogram

polyimide sheet Vespel SP-1 sheet

polyimide sheet

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Product Description

HONYPLAS®Polyimide(PI) Polyimide is a non melting high temperature polymer. Strength, dimensional stability, and creep resistance remain high even at temperatures above 260°C. Low wear rates combined with the ability to work under unlubricated conditions and high pV-rates makes it the ideal material for challenging friction and wear applications, extending lifetime and reducing maintenance costs. Its high purity and low outgassing are needed for applications in the vacuum, space and semiconductor industry.

Special properties of Polyimide PI
Long-term thermal stability 300 °C (short-term up to 400 °C)
Good cryogenic properties down to -270 °C
High strength, modulus and stiffness also at high temperatures over 260 °C
Excellent wear resistance under high surface pressure and high sliding speeds
Excellent thermal and electrical insulation
Minimal thermal conductivity
High purity, low outgassing in vacuum conditions in accordance
Good machinability
Good chemical resistance to acids, fats and solvents
Highest flame retardant grade UL-94 V-0
Irradiation resistance
Aging resistance
Polyimide PI is ideal for electrical and thermal insulating applications. More ductile than ceramics, and lighter weight than metals, and lighter weight than metals, Polyimide PI sheet plate is an excellent choice for structural parts in aerospace and other applications where metal replacement is desirable.

In Semiconductor Wafer Processing applications, Polyimide PI sheet plate can be machined as Polyimide PI wafer handling tools (wafer tips).

For IC Test Sockets & Probe Test Heads, Polyimide PI sheet plate is also an excellent replacement for vespel® SP-1. Polyimide PI sheet plate feature Continuous Operational Temperatures up to 550ºF (260ºC) and Intermitting Operation up to 900ºF

Polyimide PI sheet plate is Compression Molded.

Description Grades of SNC Polyimide PI
HONYPLAS®PI Unfilled – Natural (Unfilled) PI Highest elongation and purity. Equivalent of Vespel SP-1

HONYPLAS®PI-G15- self-lubricating grade with 15% graphite. Equivalent of Vespel SP-21

HONYPLAS®PI-Bearing bearing and wear grade, superior thermal stability. Equivalent of Vespel SCP-5050

Typical Applications of Polyimide PI
Semiconductor Industry: semiconductor manufacturing process equipment with high purity, high resistance. Such as wafer clamping rings, wafer carries, wafer guides, wafer tips, die-pickup collets, vacuum pads, bearings, centering pins, alignment pins, insulators, screws & fasteners, Semicon Insulator Bushing，Plasma Torch Tips，IC Test Sockets & Nests
Automotive industry: thrust washer or piston rings in transmission and pumps replacing traditional metals
Aero space industry: Jet engine parts such as pads, bumpers, seals and bearings
Industrial machinery: nozzle tip insulators for hot runner nozzles used for injection molding of thermoplastic products such as PET preforms, PET caps
Polyimide PI in the glass industry. The use of polyimide PI can enhance productivity in the manufacture of glass bottles for container glass, the pharmaceutical and cosmetics industry. Polyimide PI excellent temperature resistance and low thermal conductivity lend these high-performance plastics key benefits, particularly for hot-glass handling, compared to components made of graphite. They also help extend the service life of components and improve the rate of the production. In addition, Polyimide PI materials are economical to process, making them an ever more popular alternative for the production of take-out inserts and bottle grippers.

Machining Polyimide PI Vespel equivalent
Polyimide PI Vespel offers ease of machining and tight tolerances due to its inherent mechanical strength, stiffness and dimensional stability. Machining Polyimide PI Vespel isn’t too different from machining metals as a result of this; pretend you’re machining brass. Unlike metal, though, Polyimide PI Vespel (like all thermoplastics) will deform if you hold it too tightly.

We generally recommend Tungsten Carbide Alloy Tooling, although we recommend diamond tooling for large volume runs or work requiring close tolerances. Be wary of overheating Polyimide PI Vespel when you machine it. It shouldn’t become so hot that you can’t grasp it with your bare hands.

Available Szie of Polyimide PI Sheet plate

320 x320mm width and length and with minimum thickness of 2mm up to maximum thickness of 60mm

PI-12

PI-Rod Polyimide-Rod-Bar-Vespel-SP1-equivalent

Material Datasheet

PI – Polyimide
Polyimide (PI) is a non melting high temperature polymer. Strength, dimensional stability, and creep resistance remain high even at temperatures above 360°C
Properties	Temperature	Test Standard or Instrument	Unit	PI-N	PI-G15
Physical Properties
Color	–	–	–	Brown	Black
Density	–	GB1033	g/cm³	1.38-1.42	1.42-1.45
Mechanical Properties
Tensile Strength	23℃	GB/T1040-2006	Mpa	85	89
Tensile Strength	260℃	GB/T1040-2006	Mpa	49.4	54
Elongation at Break	23℃	GB/T1040-2006	%	6.3	3.7
Elongation at Break	260℃	GB/T1040-2006	%	–	–
Tensile Modulus	23℃	GB/T1040-2006	Mpa	3140	4400
Tensile Modulus	260℃	GB/T1040-2006	Mpa	–	–
Flexural Strength	23℃	GB/T1040-2000	Mpa	110	137
Flexural Strength	260℃	GB/T1040-2000	Mpa	60	99
Flexural Modulus	23℃	GB/T1040-2000	Mpa	2990	4500
Flexural Modulus	260℃	GB/T1040-2000	Mpa	1640	3000
Compress Strength	23℃	GB/T1040-2000	Mpa	135	124
Compress Strength	260℃	GB/T1040-2000	Mpa	83.8	100
Compress Modulus	23℃	GB/T1040-2000	Mpa	1620	1600
Compress Modulus	260℃	GB/T1040-2000	Mpa	1410	1400
lzod Unotched Impact Strength	23℃	GB/T16420-1996	Kj/m2	83.2	45
lzod Unotched Impact Strength	260℃	GB/T16420-1996	Kj/m2	–	–
Thermal Properties
Coefficient of Linear Expansion		296-573K	μm/m/°C	53	49
Deflection Temperature		GB/T 1634.2	℃	>360	>360
Electrical Properties
Surface Resistvity		GB1410	Ω	1014	–
Volume Resistvity		GB1410	Ω.cm	1015	–
Dielectric Strength		–	KV/mm	22	–
Dielectric Constant		–	–	3.6	–
NOTE: The data stated above are typical values intended for reference and comparison purposes only. The data should not be used as a basis for design specifications or quality control. The information is provided as a guide to the best of our knowledge and given without obligation or liability. Testing under individual application circumstances is recommended.
* PI-N, Natural (Unfilled) PI
* PI-G15, 15% Graphite Filled PI